Paper Submission Deadline extended to November 15, 2016

Please Review Formatting Requirements Here

2017 International Applied Computational Electromagnetics Society (ACES) Symposium

March 26-30, 2017

Firenze, Italy

General Chair:

Sami Barmada
University of Pisa, Italy

General Co-Chair:

Rocco Rizzo
University of Pisa, Italy

Technical Program Chairs:

Mauro Tucci
University of Pisa, Italy
Atef Elsherbeni
Colorado School of Mines, USA

Symposium Overview

The International Applied Computational Electromagnetics Society (ACES) Symposium serves as a forum for developers, analysts, and users of computational techniques applied to electromagnetic field problems for all frequency ranges. The symposium includes technical invited plenary and regular presentations, software tutorials, vendor booths, and short courses.

Papers may address general issues in applied computational electromagnetics or focus on specific applications, techniques, codes, or computational issues of potential interest to ACES members through invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches on technology trends and significant advances in relevant topics. The following is a list of suggested topics, although contributions in other areas of computational electromagnetics will also be considered.


Computational Methods
Integral Equations/Differential Equations;
Hybrid and Multi-Physics;
Low Frequency/Asymptotic and High Frequency;
Time Domain/Frequency Domain;
Parallel and GPU Computations;
Optimization Techniques

EM Modeling and Applications
Small Antennas; Wideband and Multiband Antennas; Terahertz Antennas; Antenna Arrays;
Dielectric Resonator Antennas; Printed and Conformal Antennas; RFID antennas/systems;
Space and satellite antennas; Antennas with advanced/complex/artificial materials and processes;
Bio-Electromagnetics; Wearable antennas; implantable antennas; Body channel modeling;
Radio propagation modeling and channel estimation;
EMC; Wireless power and RF energy harvesting; Near-field techniques;EMC
Engineering Metamaterials and plasmonics for absorption, cloaking, and wave manipulation;
Microwave measurement techniques; Material microwave property characterization;
Nanotechnology; Carbon nanotubes and 2D graphene electronic and optoelectronic devices;
Wide bandgap/emerging semiconductor electronic devices: characterization, modelling and design;
Advanced silicon, integrated passive devices and through substrate via;
Passive/active microwave and terahertz devices; MEMS and MMIC;
Large-area printing, inkjet printing and 3D printing technology;
Low-temperature co-fired ceramic and liquid crystal polymer based microwave devices;
Microwave remote sensing; SAR algorithms and systems; Inverse scattering; Radar techniques

Important Dates

Paper Submission Deadline: October 15, 2016

Notification of Acceptance: December 10, 2016

Final Paper Submission: December 30, 2016

Technical Sponsors:

Platinum Sponsors and Exhibitors

Gold Sponsors and Exhibitors

Silver Sponsors and Exhibitors

Additional Exhibitors